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Published Date: 2026-01-13 | Pages: 101 | Tables: 107 | New Technology
The global Through Glass Via (TGV) Technology market was valued at US$ 159 million in 2025 and is anticipated to reach US$ 821 million by 2032, at a CAGR of 25.0% from 2026 to 2032.
Through Glass Via (TGV) Technology refers to an advanced packaging technology in which through micro-vias are formed in substrates such as borosilicate glass and fused silica (quartz), and the via sidewalls are metallized to create a three-dimensional interconnect structure with vertical electrical interconnection capability. In terms of process flow, high-aspect-ratio micro-via arrays with diameters of 10–100 μm are typically formed in glass via laser drilling and dry/wet etching, followed by seed-layer deposition and electroplating fill to complete via metallization. Glass through-vias without metallization are only an intermediate form; only metallized TGV structures provide practical electrical interconnect functionality and qualify as a product.From an industrialization perspective, Through Glass Via technology ultimately materializes as TGV substrates densely populated with metallized vias, and is widely used in RF chips, high-end MEMS devices, and high-density 3D system integration. In this report’s quantitative accounting, “Through Glass Via (TGV) Technology” refers specifically to wafer-format TGV substrates that have completed via metallization and are ready for packaging applications.
The supply chain for TGV substrates typically involves upstream glass material suppliers, midstream laser drilling and copper filling processing plants, and downstream packaging houses and semiconductor manufacturers. Supplier concentration is relatively high, with significant technical barriers. Major suppliers are primarily located in the United States, Japan, South Korea, Europe, and a few regions in China.
TGV technology was initially developed by American, Japanese, and European companies to enable micro-interconnects for high-density packaging, addressing bottlenecks in high-speed and high-frequency signal transmission associated with silicon interconnects and traditional PCBs. In recent years, with the rapid development of 5G, optoelectronic devices, and sensors, TGV technology has gradually been applied in MEMS, optical modules, and high-frequency antenna packaging.
The primary industry prospects lie in high-frequency and high-speed packaging applications, such as 5G RF modules, optical communication devices, micro-sensors, and Micro-Electro-Mechanical Systems (MEMS) devices. The market for mid-to-low-end TGV products is relatively small, while high-end products maintain strong competitiveness due to their precision and reliability. In the future, with the growing demand for heterogeneous integration and advanced packaging, the TGV market is expected to continue expanding.
TGV substrate production involves processes such as glass cutting, laser drilling, cleaning, metallization, and electroplating. The production capacity of a single line is usually constrained by glass size, via diameter, and filling efficiency. A high-precision TGV production line can have an annual capacity ranging from several hundred thousand to millions of wafers, depending on the aperture, number of layers, and copper filling speed.
Due to complex processes and high technical barriers, TGV products generally yield high gross margins, typically within the range of 30% to 35%. The margin level is significantly influenced by the degree of production line automation, yield rate, and order scale.
Costs are primarily composed of raw materials (glass substrates account for approximately 50%-60%), processing technologies (laser drilling, copper deposition, electroplating, etc., accounting for 30%-40%), and equipment depreciation and labor (accounting for 10%-20%). High yield rates and high automation can significantly reduce unit costs.
After packaging is completed, TGV substrates are generally not sold separately but enter the market mainly as finished component devices. Production waste primarily consists of drilling debris, defective copper deposition products, and broken glass. Companies mitigate losses through recycling, reuse, or low-value disposal.
This report focuses on the global Through Glass Via (TGV) Technology status, future forecast, growth opportunity, key market, and key players. The study objectives are to present the Through Glass Via (TGV) Technology development in different regions.
It segments the global Through Glass Via (TGV) Technology market comprehensively. Regional market sizes by Type, by Application, by Size, and by player are also provided. For deeper insight, the report profiles the competitive landscape, key competitors, and their respective market rankings, and discusses technological trends and new product developments.
This report will assist Through Glass Via (TGV) Technology manufacturers, new entrants, and companies across the industry value chain with information on revenues, sales volume, and average prices for the overall market and its sub-segments, by company, by Type, by Application, and by region.
Market Segmentation
By Company
Corning
LPKF
Samtec
SCHOTT
Xiamen Sky Semiconductor Technology
Tecnisco
PLANOPTIK
NSG Group
AGC
JNTC
Segment by Type
Panel-Level TGV Substrate
Wafer-Level TGV Substrate
Segment by Size
300 mm Wafer Size
200 mm Wafer Size
150 mm Wafer Size
510*515 mm Panel Size
Others
Segment by Hole Diameter
D < 50 μm
D ≥ 50 μm
Segment by Application
Consumer Electronics
Automotive Electronics
High-performance Computing and Data Centers
Others
By Region
North America
Europe
Asia-Pacific
South America
Middle East
Research Methodology
The research methodology employed has been subjected by numerous procedures in order to guarantee the quality and accuracy of the data contained within the reports. The analysts are employed full-time and received more than six months training to satisfy the standard of our company. Our methodology can be divided into five stages:
★Stage 1 SECONDARY RESEARCH
The research team first collaborates with magazines, trade associations and administrative departments in the research field. The information provided by our internal documentation service is helpful for our further research. Our team has a wealth of experience and knowledge, and can effectively extract accurate information from existing resources.
★Stage 2 PRIMARY RESEARCH:INTERVIEWS WITH TRADE SOURCES
After the first stage, the research team conducts a large number of face-to-face or telephone interviews with representative companies working in the research field. Analysts are trying to have an opportunity to talk to leading companies and small companies in the field. Upstream suppliers, manufacturers, distributors, importers, installers, wholesalers and consumers were included in the interview. The data collected during the interview were then carefully examined and compared with the secondary study.
★Stage 3 ANALYSIS OF THE GATHERED DATA
The analysis team examines and synthesizes the data collected in the first two stages. In order to validate the data, a second round of interviews can be conducted.
★Stage 4 QUANTITATIVE DATA
The quantitative data such as market estimates, production and capacity of manufacturer, market forecasts and investment feasibility is provided by our company. The data is based on the estimates obtained during stage 3.
★Stage 5 QUALITY CONTROL
Before publishing, each report undergoes a rigorous review and editing process, which is done by the experience management team to ensure the reliability of the published data. Every analyst on the research team receives support and continuous training as part of our internal quality process.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Through Glass Via (TGV) Technology Market Size Growth Rate by Type (2026-2032)
1.2.2 Panel-Level TGV Substrate
1.2.3 Wafer-Level TGV Substrate
1.3 Market Analysis by Size
1.3.1 Global Through Glass Via (TGV) Technology Market Size Growth Rate by Size (2026-2032)
1.3.2 300 mm Wafer Size
1.3.3 200 mm Wafer Size
1.3.4 150 mm Wafer Size
1.3.5 510*515 mm Panel Size
1.3.6 Others
1.4 Market Analysis by Hole Diameter
1.4.1 Global Through Glass Via (TGV) Technology Market Size Growth Rate by Hole Diameter (2026-2032)
1.4.2 D < 50 μm
1.4.3 D ≥ 50 μm
1.5 Market by Application
1.5.1 Global Through Glass Via (TGV) Technology Market Share by Application (2026-2032)
1.5.2 Consumer Electronics
1.5.3 Automotive Electronics
1.5.4 High-performance Computing and Data Centers
1.5.5 Others
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global Through Glass Via (TGV) Technology Market Size
2.2 Through Glass Via (TGV) Technology Market Size by Region
2.2.1 Through Glass Via (TGV) Technology Growth Rate by Region (2026-2032)
2.2.2 Through Glass Via (TGV) Technology Market Share by Region (2026-2032)
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Use Cases
3 Key Players
3.1 Through Glass Via (TGV) Technology Revenue by Players (2026 & 2032)
3.2 Through Glass Via (TGV) Technology Key Players Headquarters and Area Served
3.3 Key Players Through Glass Via (TGV) Technology Product/Solution/Service
3.4 Date of Enter into Through Glass Via (TGV) Technology Market
3.5 Mergers & Acquisitions, Expansion Plans
4 Breakdown by Type and Application
4.1 Global Through Glass Via (TGV) Technology Market Size by Type (2026-2032)
4.2 Global Through Glass Via (TGV) Technology Market Size by Application (2026-2032)
5 North America
5.1 North America Through Glass Via (TGV) Technology Market Forecast (2026-2032)
5.2 Through Glass Via (TGV) Technology Key Players in North America
5.3 North America Through Glass Via (TGV) Technology Market Size by Type
5.4 North America Through Glass Via (TGV) Technology Market Size by Application
6 Europe
6.1 Europe Through Glass Via (TGV) Technology Market Forecast (2026-2032)
6.2 Through Glass Via (TGV) Technology Key Players in Europe
6.3 Europe Through Glass Via (TGV) Technology Market Size by Type
6.4 Europe Through Glass Via (TGV) Technology Market Size by Application
7 Asia-Pacific
7.1 Asia-Pacific Through Glass Via (TGV) Technology Market Forecast (2026-2032)
7.2 Through Glass Via (TGV) Technology Key Players in Asia-Pacific
7.3 Asia-Pacific Through Glass Via (TGV) Technology Market Size by Type
7.4 Asia-Pacific Through Glass Via (TGV) Technology Market Size by Application
8 Rest of World
8.1 South America
8.1.1 South America Through Glass Via (TGV) Technology Market Analysis
8.1.2 Key Players in South America
8.2 Middle East
8.2.1 Middle East Through Glass Via (TGV) Technology Market Analysis
8.2.2 Key Players in Middle East
9 International Players Profiles
9.1 Corning
9.1.1 Corning Company Details
9.1.2 Corning Description and Business Overview
9.1.3 Corning Through Glass Via (TGV) Technology Introduction
9.1.4 Corning Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.1.5 Corning Recent Development
9.2 LPKF
9.2.1 LPKF Company Details
9.2.2 LPKF Description and Business Overview
9.2.3 LPKF Through Glass Via (TGV) Technology Introduction
9.2.4 LPKF Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.2.5 LPKF Recent Development
9.3 Samtec
9.3.1 Samtec Company Details
9.3.2 Samtec Description and Business Overview
9.3.3 Samtec Through Glass Via (TGV) Technology Introduction
9.3.4 Samtec Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.3.5 Samtec Recent Development
9.4 SCHOTT
9.4.1 SCHOTT Company Details
9.4.2 SCHOTT Description and Business Overview
9.4.3 SCHOTT Through Glass Via (TGV) Technology Introduction
9.4.4 SCHOTT Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.4.5 SCHOTT Recent Development
9.5 Xiamen Sky Semiconductor Technology
9.5.1 Xiamen Sky Semiconductor Technology Company Details
9.5.2 Xiamen Sky Semiconductor Technology Description and Business Overview
9.5.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Introduction
9.5.4 Xiamen Sky Semiconductor Technology Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.5.5 Xiamen Sky Semiconductor Technology Recent Development
9.6 Tecnisco
9.6.1 Tecnisco Company Details
9.6.2 Tecnisco Description and Business Overview
9.6.3 Tecnisco Through Glass Via (TGV) Technology Introduction
9.6.4 Tecnisco Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.6.5 Tecnisco Recent Development
9.7 PLANOPTIK
9.7.1 PLANOPTIK Company Details
9.7.2 PLANOPTIK Description and Business Overview
9.7.3 PLANOPTIK Through Glass Via (TGV) Technology Introduction
9.7.4 PLANOPTIK Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.7.5 PLANOPTIK Recent Development
9.8 NSG Group
9.8.1 NSG Group Company Details
9.8.2 NSG Group Description and Business Overview
9.8.3 NSG Group Through Glass Via (TGV) Technology Introduction
9.8.4 NSG Group Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.8.5 NSG Group Recent Development
9.9 AGC
9.9.1 AGC Company Details
9.9.2 AGC Description and Business Overview
9.9.3 AGC Through Glass Via (TGV) Technology Introduction
9.9.4 AGC Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.9.5 AGC Recent Development
9.10 JNTC
9.10.1 JNTC Company Details
9.10.2 JNTC Description and Business Overview
9.10.3 JNTC Through Glass Via (TGV) Technology Introduction
9.10.4 JNTC Revenue in Through Glass Via (TGV) Technology Business (2026 & 2032)
9.10.5 JNTC Recent Development
10 Through Glass Via (TGV) Technology Market Dynamics
10.1 Through Glass Via (TGV) Technology Industry Trends
10.2 Through Glass Via (TGV) Technology Market Drivers
10.3 Through Glass Via (TGV) Technology Market Challenges
10.4 Through Glass Via (TGV) Technology Market Restraints
11 Key Findings in This Report
12 Appendix
12.1 Research Methodology
12.1.1 Methodology/Research Approach
12.1.1.1 Research Programs/Design
12.1.1.2 Market Size Estimation
12.1.1.3 Market Breakdown and Data Triangulation
12.1.2 Data Source
12.1.2.1 Secondary Sources
12.1.2.2 Primary Sources
12.2 Disclaimer
12.3 Author Details
List of Tables
Table 1. Global Through Glass Via (TGV) Technology Market Size Growth Rate by Type (2026-2032) & (US$ Million)
Table 2. Key Players of Panel-Level TGV Substrate
Table 3. Key Players of Wafer-Level TGV Substrate
Table 4. Global Through Glass Via (TGV) Technology Market Size Growth Rate by Size (2026-2032) & (US$ Million)
Table 5. Key Players of 300 mm Wafer Size
Table 6. Key Players of 200 mm Wafer Size
Table 7. Key Players of 150 mm Wafer Size
Table 8. Key Players of 510*515 mm Panel Size
Table 9. Key Players of Others
Table 10. Global Through Glass Via (TGV) Technology Market Size Growth Rate by Hole Diameter (2026-2032) & (US$ Million)
Table 11. Key Players of D < 50 μm
Table 12. Key Players of D ≥ 50 μm
Table 13. Global Through Glass Via (TGV) Technology Market Size Growth by Application (2026-2032) & (US$ Million)
Table 14. Global Through Glass Via (TGV) Technology Market Size by Region (2026-2032) & (US$ Million)
Table 15. Global Through Glass Via (TGV) Technology Market Size by Region (2026-2032) & (US$ Million)
Table 16. Global Through Glass Via (TGV) Technology Market Share by Region (2026-2032)
Table 17. Market Top Trends
Table 18. Market Use Cases
Table 19. Global Through Glass Via (TGV) Technology Revenue by Players (2026 & 2032) & (US$ Million)
Table 20. Global Through Glass Via (TGV) Technology Market Share by Players (2026 & 2032)
Table 21. Key Players Headquarters and Area Served
Table 22. Key Players Through Glass Via (TGV) Technology Product/Solution/Service
Table 23. Date of Enter into Through Glass Via (TGV) Technology Market
Table 24. Mergers & Acquisitions, Expansion Plans
Table 25. Global Through Glass Via (TGV) Technology Market Size by Type (2026-2032) & (US$ Million)
Table 26. Global Through Glass Via (TGV) Technology Market Size Share by Type (2026-2032)
Table 27. Global Through Glass Via (TGV) Technology Market Size by Application (2026-2032) & (US$ Million)
Table 28. Global Through Glass Via (TGV) Technology Market Size Share by Application (2026-2032)
Table 29. North America Key Players Through Glass Via (TGV) Technology Revenue (2026 & 2032) & (US$ Million)
Table 30. North America Key Players Through Glass Via (TGV) Technology Market Share (2026 & 2032)
Table 31. North America Through Glass Via (TGV) Technology Market Size by Type (2026-2032) & (US$ Million)
Table 32. North America Through Glass Via (TGV) Technology Market Share by Type (2026-2032)
Table 33. North America Through Glass Via (TGV) Technology Market Size by Application (2026-2032) & (US$ Million)
Table 34. North America Through Glass Via (TGV) Technology Market Share by Application (2026-2032)
Table 35. Europe Key Players Through Glass Via (TGV) Technology Revenue (2026 & 2032) & (US$ Million)
Table 36. Europe Key Players Through Glass Via (TGV) Technology Market Share (2026 & 2032)
Table 37. Europe Through Glass Via (TGV) Technology Market Size by Type (2026-2032) & (US$ Million)
Table 38. Europe Through Glass Via (TGV) Technology Market Share by Type (2026-2032)
Table 39. Europe Through Glass Via (TGV) Technology Market Size by Application (2026-2032) & (US$ Million)
Table 40. Europe Through Glass Via (TGV) Technology Market Share by Application (2026-2032)
Table 41. Asia-Pacific Key Players Through Glass Via (TGV) Technology Revenue (2026 & 2032) & (US$ Million)
Table 42. Asia-Pacific Key Players Through Glass Via (TGV) Technology Market Share (2026 & 2032)
Table 43. Asia-Pacific Through Glass Via (TGV) Technology Market Size by Type (2026-2032) & (US$ Million)
Table 44. Asia-Pacific Through Glass Via (TGV) Technology Market Share by Type (2026-2032)
Table 45. Asia-Pacific Through Glass Via (TGV) Technology Market Size by Application (2026-2032) & (US$ Million)
Table 46. Asia-Pacific Through Glass Via (TGV) Technology Market Share by Application (2026-2032)
Table 47. Key Players in South America
Table 48. Key Players in Middle East
Table 49. Corning Company Details
Table 50. Corning Description and Business Overview
Table 51. Corning Through Glass Via (TGV) Technology Product
Table 52. Corning Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 53. Corning Recent Development
Table 54. LPKF Company Details
Table 55. LPKF Description and Business Overview
Table 56. LPKF Through Glass Via (TGV) Technology Product
Table 57. LPKF Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 58. LPKF Recent Development
Table 59. Samtec Company Details
Table 60. Samtec Description and Business Overview
Table 61. Samtec Through Glass Via (TGV) Technology Product
Table 62. Samtec Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 63. Samtec Recent Development
Table 64. SCHOTT Company Details
Table 65. SCHOTT Description and Business Overview
Table 66. SCHOTT Through Glass Via (TGV) Technology Product
Table 67. SCHOTT Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 68. SCHOTT Recent Development
Table 69. Xiamen Sky Semiconductor Technology Company Details
Table 70. Xiamen Sky Semiconductor Technology Description and Business Overview
Table 71. Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Technology Product
Table 72. Xiamen Sky Semiconductor Technology Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 73. Xiamen Sky Semiconductor Technology Recent Development
Table 74. Tecnisco Company Details
Table 75. Tecnisco Description and Business Overview
Table 76. Tecnisco Through Glass Via (TGV) Technology Product
Table 77. Tecnisco Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 78. Tecnisco Recent Development
Table 79. PLANOPTIK Company Details
Table 80. PLANOPTIK Description and Business Overview
Table 81. PLANOPTIK Through Glass Via (TGV) Technology Product
Table 82. PLANOPTIK Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 83. PLANOPTIK Recent Development
Table 84. NSG Group Company Details
Table 85. NSG Group Description and Business Overview
Table 86. NSG Group Through Glass Via (TGV) Technology Product
Table 87. NSG Group Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 88. NSG Group Recent Development
Table 89. AGC Company Details
Table 90. AGC Description and Business Overview
Table 91. AGC Through Glass Via (TGV) Technology Product
Table 92. AGC Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 93. AGC Recent Development
Table 94. JNTC Company Details
Table 95. JNTC Description and Business Overview
Table 96. JNTC Through Glass Via (TGV) Technology Product
Table 97. JNTC Revenue in Through Glass Via (TGV) Technology Business: 2026 & 2032
Table 98. JNTC Recent Development
Table 99. Through Glass Via (TGV) Technology Market Trends
Table 100. Through Glass Via (TGV) Technology Market Drivers
Table 101. Through Glass Via (TGV) Technology Market Challenges
Table 102. Through Glass Via (TGV) Technology Market Restraints
Table 103. Research Programs/Design for This Report
Table 104. Key Data Information from Secondary Sources
Table 105. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Through Glass Via (TGV) Technology Market Share by Type in 2026 & 2032
Figure 2. Panel-Level TGV Substrate Features
Figure 3. Wafer-Level TGV Substrate Features
Figure 4. Global Through Glass Via (TGV) Technology Market Share by Size in 2026 & 2032
Figure 5. 300 mm Wafer Size Features
Figure 6. 200 mm Wafer Size Features
Figure 7. 150 mm Wafer Size Features
Figure 8. 510*515 mm Panel Size Features
Figure 9. Others Features
Figure 10. Global Through Glass Via (TGV) Technology Market Share by Hole Diameter in 2026 & 2032
Figure 11. D < 50 μm Features
Figure 12. D ≥ 50 μm Features
Figure 13. Global Through Glass Via (TGV) Technology Market Share by Application in 2026 & 2032
Figure 14. Consumer Electronics Case Studies
Figure 15. Automotive Electronics Case Studies
Figure 16. High-performance Computing and Data Centers Case Studies
Figure 17. Others Case Studies
Figure 18. Through Glass Via (TGV) Technology Report Years Considered
Figure 19. Global Through Glass Via (TGV) Technology Market Size and Growth Rate 2026-2032 (US$ Million)
Figure 20. Global Through Glass Via (TGV) Technology Market Share by Region (2026-2032)
Figure 21. Global Through Glass Via (TGV) Technology Market Size Market Share by Type (2026-2032)
Figure 22. North America Through Glass Via (TGV) Technology Market Size 2026-2032 (US$ Million)
Figure 23. Europe Through Glass Via (TGV) Technology Market Size 2026-2032 (US$ Million)
Figure 24. Asia-Pacific Through Glass Via (TGV) Technology Market Size 2026-2032 (US$ Million)
Figure 25. Through Glass Via (TGV) Technology Market Size in South America (2026-2032) & (US$ Million)
Figure 26. Through Glass Via (TGV) Technology Market Size in Middle East (2026-2032) & (US$ Million)
Figure 27. Bottom-up and Top-down Approaches for This Report
Figure 28. Data Triangulation
Figure 29. Key Executives Interviewed
